JH PCBA Rigid-Flex PCB

JH PCBA helps customers finish a lot of projects including wearable technology, medical devices, automotive systems, and IoT applications etc. We can produce a maximum 24L rigid pcb + 8L flex pcb. This enables the processing of complex and high-performance projects across a wide range of industries. This manufacturing capability is particularly valuable for advanced applications such as wearable technology, medical devices, automotive systems and IoT devices, where space constraints and reliability are critical.

Cost-Effective Manufacturing

Integrated Assembly: Combining rigid and flex circuits reduces the number of individual components and assembly steps, which can lower manufacturing costs.

Lower Maintenance Costs: Fewer connectors and mechanical parts mean less frequent maintenance, leading to long-term cost savings.

Increased Durability and Performance

Resistance to Environmental Stress: Rigid-flex PCBs are more resistant to vibrations, shocks, and environmental factors like moisture, making them ideal for automotive and aerospace applications.

Longevity in Wearable Devices: The flexibility of the PCB allows it to withstand repeated bending, making it ideal for wearable technology that requires frequent movement.

What is Rigid-Flex PCB?

The unique combination of rigid and flexible components offers versatility and reliability, making it an ideal solution for various industries, including wearable technology, medical devices, automotive systems, and IoT applications.

As the demand for innovative and adaptable electronics rises, rigid-flex PCBs are expected to play a pivotal role in meeting these evolving requirements, driving advancements in design, materials, and manufacturing techniques to support the development of next-generation products.

Rigid-flex PCB technology’s impact on the electronics industry

Miniaturization

Rigid-flex PCBs support the trend toward miniaturization in electronics, allowing for smaller and lighter devices with increased functionality while maintaining high performance and reliability.

Design innovation

The versatility of rigid-flex PCBs enables the creation of complex and innovative designs, which can conform to non-planar surfaces and accommodate unique geometries, pushing the boundaries of electronic device design.

Simplified assembly

By combining rigid and flexible components into a single PCB, rigid-flex technology simplifies the assembly process, reduces the number of components, and lowers overall production costs.

Eco-friendly solutions

The adoption of rigid-flex PCB technology can contribute to more sustainable and environmentally friendly electronic devices by reducing material waste and promoting energy-efficient designs.

Rigid-Flex PCB capacity

Item Category		Small and Medium Batches Order (Order area ≥10㎡)	Prototype Order (Order area < 3㎡)
Product structure		1+n+1; 1+1+n+1+1; 2+n+2	1+n+1, 1+1+n+1+1, 2+n+2
Product structure		F+R, cu+F+cu, R+F+R+F+R, R+F+R	F+R, cu+F+cu, R+F+R+F+R, R+F+R
Number of layers	Rigid-flex PCB	≤18L	≤24L
Number of layers	FPC	≤10L	≤16L
Board thickness (mm)	Rigid-flex board	0.3-3.2	0.3-3.2
Board thickness (mm)	FPC	0.06-0.35	0.06-0.35
Board size (mm)	Rigid-flex PCB	1515 to 310510	1515 to 310510
Board size (mm)	FPC	515 to 310510	515 to 310510
Copper thickness (OZ)	Maximum copper thickness of FR-4	Outer layer 2OZ, inner layer 2OZ	Outer layer 2OZ, inner layer 2OZ
Copper thickness (OZ)	Maximum copper thickness of FPC	Outer layer 1 OZ, inner layer 1 OZ	Outer layer 2 OZ, inner layer 2 OZ
Minimum copper trace width and spacing capability (um)		75/75	75/75
Minimum diameter of mechanical drill (mm)		0.2	0.15
Rigid part material	Tg170	S1000-2M,IT180A	S1000-2M,IT180A
	High TG halogen-free	S1165	S1165
	Thickness of dielectric layer (mm)	0.1-3.2	0.075-3.2
Flex part material	Flexible material	PI DuPont, Panasonic, Shengyi	PI DuPont, Panasonic, Shengyi
	Surface insulation layer	Cover film, soldermask	Cover film, soldermask
	Thickness of dielectric layer (mm)	0.025-0.1	0.012-0.1
Surface treatment	Rigid-flex board	HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger , immersion gold + OSP	HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger, immersion gold + OSP
Surface treatment	FPC	FPC	HASL with lead / lead-free, immersion gold, OSP