JH PCBA MCPCB, Metal Core PCB, IMS (Isolated Metal Substrate)
Manufacture 1-4 Layer aluminum and copper PCB, thermal Conductivity of aluminum PCB: 1- 5w, thermal Conductivity of thermal-electric separation copper PCB: 150W-300W; Special Material: Bergquist, Japan Sumitomo, PTTC, and so on.
What is MCPCB?
Metal core pcb is abbreviated as MCPCB, also named as IMS (Isolated Metal Substrate). It is made of thermal insulating layer, metal plate and metal copper foil, which has special magnetic conductivity, excellent heat dissipation, high mechanical strength and good processing performance.
For metal core base material, there is aluminum and copper base materials. Aluminum substrate is a kind of metal-based copper clad plate with good heat transferring and dissipation function. Copper substrate has better performance than aluminum, but its price is relatively more expensive than aluminum.
Clients order aluminum pcbs more often, because the price of aluminum pcb is much more economic, they are used in cars on indicators, in headlights and brake lights, and other automotive applications, medical equipment high power LED lighting and communication electronic equipment and so on.
Aluminum PCB with counteorrbes
Aluminum-based printed circuit boards are circuit boards with aluminum as the base material. They have excellent thermal conductivity and mechanical strength and are widely used in high-power electronic devices and LED lighting. Aluminum substrates can effectively conduct heat away from key components, improving product stability and lifespan.
Copper PCB with ENIG surface finishing
Copper PCB with ENIG surface finishing is a type of printed circuit board that uses copper as the substrate. Since copper has excellent electrical and thermal conductivity, this type of PCB is often used in applications that require high power, high frequency, and high heat dissipation. Compared with aluminum-based PCBs, copper-based PCBs have higher thermal conductivity, so they are used in some special high-performance electronic devices.
What kind of MCPCB JH PCBA can provide?
1)MCPCB we can provide as:
- Aluminum-based PCB
- Copper-based PCB
- Ceramic-based PCB
- Others: Iron-based PCB
2)Various brand material available:
- ITEQ Bergquist TOTKING Ventec PTTC
- CCAF CHIN-SHI KunShan Uniplus Japan Sumitomo
3)Featured MCPCB JH PCBA can provide:
- Thermal-electric separation copper-based pcb: 150W-300W high power miner lamp and streetlight.
- COB silver mirror aluminum PCB: after assembly, lights reflectivity up to 98%, luminous efficiency up to 120 LM.
- Ceramic-based pcb: thermal conductivity about 26W, withstand high voltage to 8000-10000V.
- Ceramic-based pcb: thermal conductivity about 26W, withstand high voltage to 8000-10000V.
JH PCBA MCPCB Manufacturing Capability
Type | Item | Parameter | Drawing |
---|---|---|---|
manufact ure capacity | ayer count: | 1-12L | / |
mixed stackup | FR-4+aluminum substrate
FR-4+copper substrate |
/ | |
PCB thickness | aluminum substrate 0.6-5.0mm
copper substrate 0.6-3.0mm |
/ | |
thickness tolerance | ≤1.0mm: +/-0.10mm,
>.0mm:+/-10%. |
/ | |
minimum pcb size | 2.5×2.5mm need create panel, 10x10mm cando single board. | / | |
minimum pcb size | 500x1200mm | / | |
maximum copper | 30z | / | |
manufact ure capacity1 | ayer count: | 1-12L | / |
mixed stackup | FR-4+aluminum substrate
FR-4+copper substrate |
/ | |
PCB thickness | aluminum substrate 0.6-5.0mm
copper substrate 0.6-3.0mm |
/ | |
thickness tolerance | ≤1.0mm: +/-0.10mm,
>.0mm:+/-10%. |
/ | |
minimum pcb size | 2.5×2.5mm need create panel, 10x10mm cando single board. | / | |
minimum pcb size | 500x1200mm | / | |
maximum copper | 30z | / |
Material for MCPCB
Material for metal core boards 1 Layer | Thermal conductivity | Thermal resistance | Surface Resistivity | Dielectric glass transition(Tg) | Dielectric Breakdown(AC)* | Tracking resistance CTI |
---|---|---|---|---|---|---|
TC-Lam 2.0 | 2.0 W/mK | 0.50 K/W | 10^7 MΩ | 100°C | 5.0 kV | 0 PLC |
HA50 (3) | 2.2 W/mK | 0.41 K/W | 10^6 MΩ | 120°C | 4.3 kV | 0 PLC |
AL-200 | 2.0 W/mK | 0.35 K/W | 10^8 MΩ | – | 3.5 kV | 0 PLC |
AL-300 | 3.0 W/mK | 0.30 K/W | 10^8 MΩ | – | 3.5 kV | 0 PLC |
Ventec VT-4B4 Ceramic Filled | 3.0 W/mK | – | 5 x 10^8 MΩ | 130°C | 8.0 kV | 0 PLC |
Ventec VT-4B4 Ceramic Filled | 4.2 W/mK | – | 2 x 10^7 MΩ | 120°C | 8.0 kV | 0 PLC |
Ventec VT-4B7 Ceramic Filled | 7.0 W/mK | – | 2 x 10^7 MΩ | 100°C | 8.0 kV | 0 PLC |
Construction and Manufacturing Process for MCPCB
Sheet Cutting-Drilling-Circuit-Etch-Solder maskSilkscreen-Surface Finishing-Forming-Test
Sheet Cutting(FR4)-Drilling-PTH-Circuit-Plating-Etch-Test-Laminating(FR4+Metal Core)-Solder mask-Silkscreen-Surface-2nd Drilling-Forming-Test
Sheet Cutting(FR4)-Drilling-PTH-Circuit-Plating-Etch-Test-Laminating(FR4+Metal Core)-Solder mask-Sikscreen-Surface-2nd Drilling-Forming-Test
Sheeting cutting-Drilling(Drill resin hole)-plug resin-Laminate(laminatesurface copper)-Drilling(Drill actual size hole)-PTH-
Circuit-Plating-Etch-Solder mask-Silkscreen-Surface Finishing-2nd Drilling-Forming-Test
Sheeting Cutting-Drilling(Drill resin hole)-plug resin-Laminate(laminatesurface copper)-Drilling(Drill actual size hole)-PTH-
Circuit-Plating-Etch-Solder mask-Silkscreen-Surface Finishing-2nd Drilling-Forming-Test
Sheet Cutting(FR4)*2-Drilling-PTH-Circuit-Plating-Etch-Test-Laminating(FR4+Metal Core)-Solder mask-Silkscreen-Surface-2nd Drilling-Forming-Test
MCPCB Case
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard
Data Acquisition Motherboard